Publication number: 20200411942
Filed: Jun 26, 2020
Publication Date: Dec 31, 2020
Applicant: Nokia Solutions and Networks Oy (Espoo)
Inventors: Florian Pivit (Dublin), Senad Bulja (Dublin)
Application Number: 16/913,790
Abstract: In this invention submission a method for direct integration of PCB structures with 3D printed parts. The method is exemplarily illustrated with reference to Figure 1.