Dr. Senad Bulja, PhD, FIET, SMIEEE

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Home » Patents » Composite Substrate for Radio Frequency Signals and Method of Manufacturing a Composite Substrate

Composite Substrate for Radio Frequency Signals and Method of Manufacturing a Composite Substrate

Dr. Senad Bulja 13/03/2023Download Here

Publication number: 20200153076
Type: Application
Filed: May 15, 2018
Publication Date: May 14, 2020
Inventors: Senad Bulja (Dublin), Wolfgang Templ (Sersheim), Rose Fasano Kopf (Green Brook, NJ), Florian Pivit (Dublin)
Application Number: 16/632,940

Abstract: The problem that this invention submission intends to solve is to propose a way that enables penetration of mm-wave signals through glass interface without imparing the visual characteristics that windows are intended to serve.  The basic idea of the present invention submission lies with the proposal of transparent RF filters operational at mm-wave frequencies. The idea is facilitated by my earlier invention , (20200127357, Composite Substrate for a Waveguide and Method of Manufacturing a Composite Substrate) which proposes the manipulation of composite dielectric characteristics of dielectrics by interlacing dielectrics with conductors. 

The crux of the idea rests on the creation of a mm-wave filter filter through interlacing glass and transparent conductors to achieve transmission of RF signals through glass surfaces. Fig. 1 shows a top-level implementation of a 3-pole filter that could be mounted on windows, such as house or car windows. 

Fig. 1 (a) Cross-section of possible realisation of a transparent 3-pole RF filter using multi-layered dielectrics and (b) Implementation of transparent 3-pole filter, perspective view.
Fig. 1 (a) Cross-section of possible realisation of a transparent 3-pole RF filter using multi-layered dielectrics and (b) Implementation of transparent 3-pole filter, perspective view.

The resonators denoted by Y3 and admittance transformers denoted by Y2 are realized through the use of our earlier invention (20200127357, Composite Substrate for a Waveguide and Method of Manufacturing a Composite Substrate) to yield a mm-wave transparent filter.

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Profile & Bio

Senad Bulja, Ph.D., FIET, SMIEEE 

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PROFESSIONAL Profile

  • Accomplished career of over 19 years demonstrating consistent success as a Researcher, Leader and Mentor in the Wireless industry research environment.
  • Excellent Scientific contributions in the field of RF, EMC and telecommunications with 4 Nature Journal publications and over 70 peer-reviewed articles and conference papers
  • Strong leadership skills demonstrated by leading Ph.D. level educated cross-continental and cross-departmental teams to successful project execution.  
  • Proven Strategic Business Impact – introduced own developed technology into Nokia’s future technology roadmap (RF filters) and business transfer of the smart surface technology. 
  • Creative, internationally awarded and well-driven inventor with over 70 filed patents in the area of hardware for Radio Frequency (RF), Wireless Sensor Networks (WSN), Internet of Things (IoT) and wireless systems architectures. E.g. Nokia patent award entitled: “A top inventor in implementation patent first filings”, 2020.
  • Significant contribution in the identification of high revenue IP assets and leadership on the creation of Nokia’s patent portfolio roadmap. 
 

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