Dr. Senad Bulja, PhD, FIET, SMIEEE

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Home » Researches » Very low-profile multilayer broadband microstrip antenna

Very low-profile multilayer broadband microstrip antenna

Dr. Senad Bulja 15/02/2023Download Here

Microstrip antennas have been extensively used in the past because of their several advantages (low weight, low cost, conformability, and low profile) over conventional antennas. However, their small impedance bandwidth has always been a major constraint as it limits the frequency range over which the antenna can perform satisfactorily. As many authors have showed it, employing thick dielectrics can increase the bandwidth, but at the expense of reduction of the cut-off frequency of surface waves and as a result, the distortion of the radiation pattern. Furthermore, in many applications, a high-profile microstrip antenna is not desirable. In this paper, a very low-profile broadband microstrip antenna is introduced. The antenna is three-layer, consisting of three stacked patches on three thin substrates, fed by a microstrip line connected to the middle patch, Fig. 1. In order to show the development of the antenna, initially, the single patch microstrip antenna and the double patch microstrip antenna developed on low-profile substrates with the same overall thickness and dielectric constant, are studied. Then the development of the low-profile triple-patch antenna on three substrates with the same overall thickness as those of the single- and double-patch microstrip antenna, is reported. 

The proposed antenna provides 22% bandwidth about a centre frequency of 5 GHz. In this antenna, the feed line was applied to the middle patch. Although not reported in this paper, it was found that the antenna is scalable for operation at other centre frequencies. However, the only constraint is the availability of commercial substrates at the scaled thicknesses.

Fig. 1 The triple patch microstrip antenna (left) and reflection coefficient for the proposed triple patch antenna (right): (a) simulated and (b) measured.
Fig. 1 The triple patch microstrip antenna (left) and reflection coefficient for the proposed triple patch antenna (right): (a) simulated and (b) measured.

 

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Profile & Bio

Senad Bulja, Ph.D., FIET, SMIEEE 

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PROFESSIONAL Profile

  • Accomplished career of over 19 years demonstrating consistent success as a Researcher, Leader and Mentor in the Wireless industry research environment.
  • Excellent Scientific contributions in the field of RF, EMC and telecommunications with 4 Nature Journal publications and over 70 peer-reviewed articles and conference papers
  • Strong leadership skills demonstrated by leading Ph.D. level educated cross-continental and cross-departmental teams to successful project execution.  
  • Proven Strategic Business Impact – introduced own developed technology into Nokia’s future technology roadmap (RF filters) and business transfer of the smart surface technology. 
  • Creative, internationally awarded and well-driven inventor with over 70 filed patents in the area of hardware for Radio Frequency (RF), Wireless Sensor Networks (WSN), Internet of Things (IoT) and wireless systems architectures. E.g. Nokia patent award entitled: “A top inventor in implementation patent first filings”, 2020.
  • Significant contribution in the identification of high revenue IP assets and leadership on the creation of Nokia’s patent portfolio roadmap. 
 

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