Publication number: 20200313265
Type: Application
Filed: Mar 19, 2020
Publication Date: Oct 1, 2020
Patent Grant number: 11276907
Inventors: Florian Pivit (Dublin), Senad Bulja (Dublin)
Application Number: 16/823,395
Abstract: In this invention single and multi-layered PCB distributed resonators and filters implemented in PCB technology are presented. Fig. 1 depicts how such resonators can be implemented. Distributed resonators and filters have been previously introduced by the author as the means of profile reduction.
![Figure 1 Multi-layer PCB implementation (a) and single layer implementation (b) (vertical cross-section through the layer stack), thick black lines representing metalization resp. plating with conductive metal, thin lines representing PCB-layer boundaries)](https://drbulja.com/wp-content/uploads/2023/03/figure-1-multi-layer-pcb-implementation.jpg)
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